NXP SemiconductorsSPC5566MZP80RMicrocontrollers - MCUs
MCU 32-bit e200z6 RISC 3MB Flash 1.8V/2.5V/3.3V/5V Automotive AEC-Q100 416-Pin BGA T/R
| Not Compliant | |
| 3A991a.2. | |
| Active | |
| 8542.31.00.25 | |
| SVHC | Yes |
| SVHC überschreitet Schwellenwert | Yes |
| Automotive | Yes |
| PPAP | Yes |
| MPC55xx | |
| RISC | |
| e200z6 | |
| e200 | |
| 80 | |
| 80 | |
| 32 | |
| Flash | |
| 3MB | |
| 128KB | |
| Yes | |
| CAN/SCI/SPI | |
| 256 | |
| 1 | |
| 1 | |
| 1 | |
| 40 | |
| 12 | |
| 0 | |
| 0 | |
| 0 | |
| 4 | |
| 0 | |
| 0 | |
| 4 | |
| 0 | |
| 1.35|1.62|3|4.5 | |
| 1.8|2.5|3.3|5 | |
| 1.65|3.6|5.25 | |
| -40 | |
| 125 | |
| Automotive | |
| Tape and Reel | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 1.95(Max) mm |
| Verpackungsbreite | 27 mm |
| Verpackungslänge | 27 mm |
| Leiterplatte geändert | 416 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | BGA |
| 416 | |
| Leitungsform | Ball |
| EDA / CAD Models |
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