NXP SemiconductorsSPC5668GF1AVMGRMicrocontrollers - MCUs
MCU 32-bit e200z650 RISC 2MB Flash 3.3V/5V Automotive AEC-Q100 208-Pin MAP-BGA T/R
| Compliant | |
| 3A991a.2. | |
| Active | |
| 8542.31.00.25 | |
| SVHC | Yes |
| Automotive | Yes |
| PPAP | Yes |
| MPC56xx | |
| RISC | |
| e200z650 | |
| e200 | |
| 116 | |
| 116 | |
| 32 | |
| Flash | |
| 2MB | |
| 592KB | |
| Yes | |
| 90nm | |
| CAN/Ethernet/I2C/SCI/SPI | |
| 155 | |
| 1 | |
| 16 | |
| 24 | |
| 1 | |
| 36 | |
| 10 | |
| 0 | |
| 0 | |
| 0 | |
| 4 | |
| 4 | |
| 0 | |
| 6 | |
| 1 | |
| 1 | |
| No | |
| No | |
| CAN Controller | |
| 3|4.5 | |
| 3.3|5 | |
| 3.6|5.5 | |
| -40 | |
| 105 | |
| Automotive | |
| Tape and Reel | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 1.3(Max) |
| Verpackungsbreite | 17 |
| Verpackungslänge | 17 |
| Leiterplatte geändert | 208 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | MAP-BGA |
| 208 | |
| Leitungsform | Ball |
| EDA / CAD Models |
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