3rd Generation Silicon Carbide (SiC) MOSFETs
Toshiba's 3rd generation 1200V Silicon Carbide (SiC) MOSFETs provide lower power consumption and support higher power density for applications such as off-board EV charging stations. The devices include a built-in SiC Schottky Barrier Diode (SBD), with a low forward voltage (VF) of -1.35V (typ.), to suppress fluctuation in RDS(on) thereby enhancing reliability. Furthermore, Toshiba’s advanced SiC process has greatly improved on-resistance per unit area RonA as well as performance index Ron*Qgd.
Features and Benefits
- • Chip design of 3rd generation (Built-in SiC Schottky barrier diode)
- • Low diode forward voltage: VDSF = -1.35 V (typ.)
- • High voltage: VDSS = 1200 V
- • Low drain-source on-resistance: RDS(ON) = 15 m Ω (typ.)
- • Less susceptible to malfunction due to high threshold voltage: Vth = 3.0 to 5.0 V (VDS = 10 V, I D = 11.7 mA)
- • Recommended gate - source drive voltage: VGS_on = 18 V, VGS_off = 0 V
Applications
- • Automotive EV off-board charging stations
- • Switching power supplies (servers, data servers, communications equipment, etc.)
- • Photovoltaic inverters
- • Uninterruptible power supplies (UPS)
Related Products
TW030N120C,S1F
TW045Z120C,S1F
TW015Z120C,S1F
TW030Z120C,S1F
TW045Z120C,S1F
| Compliant | |
| 5A991 | |
| Obsolete | |
| 8541.49.80.00 | |
| Automotive | No |
| PPAP | No |
| 5.5 | |
| 72 | |
| 5000 | |
| -40 | |
| 105 | |
| 4.5 | |
| 5 | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 2.1 mm |
| Verpackungsbreite | 7.5 mm |
| Verpackungslänge | 5.85 mm |
| Leiterplatte geändert | 8 |
| Standard-Verpackungsname | SO |
| Lieferantenverpackung | SO |
| 8 | |
| Leitungsform | Gull-wing |
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