| Compliant | |
| EAR99 | |
| Active | |
| 8542.39.00.90 | |
| Automotive | No |
| PPAP | No |
| Low Side | |
| Non-Inverting | |
| 2 | |
| IGBT|MOSFET | |
| Bipolar|CMOS | |
| 2 | |
| 40 | |
| 40 | |
| 150 | |
| CMOS|TTL | |
| 4 | |
| 15 | |
| 1.8 | |
| 1.2 | |
| 2.2 | |
| 4(Typ) | |
| 2.2|30 | |
| 350 | |
| -40 | |
| 105 | |
| Enable Control | |
| Tube | |
| Befestigung | Through Hole |
| Verpackungshöhe | 5.08(Max) - 0.51(Min) |
| Verpackungsbreite | 6.35 |
| Verpackungslänge | 9.59 |
| Leiterplatte geändert | 8 |
| Standard-Verpackungsname | DIP |
| Lieferantenverpackung | PDIP |
| 8 | |
| Leitungsform | Through Hole |
Working with high voltage decision making circuits? This UCC27424P power driver by Texas Instruments will properly help switch states. This device has a maximum propagation delay time of 150 ns and a maximum power dissipation of 350 mW. Its maximum power dissipation is 350 mW. In order to ensure parts aren't damaged by bulk packaging, this product comes in tube packaging to add a little more protection by storing the loose parts in an outer tube. This gate driver has a minimum operating temperature of -40 °C and a maximum of 105 °C. This device has a minimum operating supply voltage of 4 V and a maximum of 15 V.
| EDA / CAD Models |
Playbook: Smarte Drohnen-Systeme
Downloaden Sie das Playbook für praxisnahe Tools und Strategien zur Entwicklung agiler, effizienter und modularer Drohnensysteme.