| Compliant | |
| EAR99 | |
| Active | |
| 8542.39.00.90 | |
| Automotive | Yes |
| PPAP | Yes |
| Low Side | |
| Non-Inverting | |
| 2 | |
| IGBT|MOSFET | |
| 2 | |
| 40 | |
| 40 | |
| 150 | |
| CMOS|TTL | |
| 4 | |
| 15 | |
| 1.8 | |
| 1.2 | |
| 2.2 | |
| 4(Typ) | |
| 2.2|30 | |
| 650 | |
| -40 | |
| 125 | |
| Automotive | |
| Tape and Reel | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.95(Max) |
| Verpackungsbreite | 3.1(Max) |
| Verpackungslänge | 3.1(Max) |
| Leiterplatte geändert | 8 |
| Standard-Verpackungsname | SO |
| Lieferantenverpackung | HVSSOP EP |
| 8 | |
| Leitungsform | Gull-wing |
Manage power passing through your transistors and gates with the use of Texas Instruments' UCC27424QDGNRQ1 power driver. This device has a maximum propagation delay time of 150 ns and a maximum power dissipation of 650 mW. Its maximum power dissipation is 650 mW. This component will be shipped in tape and reel packaging to allow for effective mounting and safe delivery. This device has a minimum operating supply voltage of 4 V and a maximum of 15 V. This gate driver has an operating temperature range of -40 °C to 125 °C.
| EDA / CAD Models |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.

