| Compliant | |
| EAR99 | |
| Active | |
| 8542.39.00.01 | |
| Automotive | No |
| PPAP | No |
| Low Side | |
| Non-Inverting | |
| 2 | |
| IGBT|MOSFET | |
| 2 | |
| 40 | |
| 40 | |
| 35 | |
| CMOS|TTL | |
| 4.5 | |
| 15 | |
| 0.75 | |
| 1.2 | |
| 2.2 | |
| 4.5 | |
| 30|2.2 | |
| 780 | |
| 0 | |
| 70 | |
| Tube | |
| Befestigung | Through Hole |
| Verpackungshöhe | 5.08(Max) - 0.51(Min) |
| Verpackungsbreite | 6.35 |
| Verpackungslänge | 9.59 |
| Leiterplatte geändert | 8 |
| Standard-Verpackungsname | DIP |
| Lieferantenverpackung | PDIP |
| 8 | |
| Leitungsform | Through Hole |
Sleep easy by implementing this UCC37324PE4 power driver by Texas Instruments. This device has a maximum propagation delay time of 35 ns and a maximum power dissipation of 780 mW. Its maximum power dissipation is 780 mW. In order to ensure parts aren't damaged by bulk packaging, this product comes in tube packaging to add a little more protection by storing the loose parts in an outer tube. This gate driver has an operating temperature range of 0 °C to 70 °C. This device has a minimum operating supply voltage of 4.5 V and a maximum of 15 V.
| EDA / CAD Models |
Playbook: Smarte Drohnen-Systeme
Downloaden Sie das Playbook für praxisnahe Tools und Strategien zur Entwicklung agiler, effizienter und modularer Drohnensysteme.