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Winbond ElectronicsW25M512JVCIQFlash
NOR Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 512M-bit 64M x 8 7ns 24-Pin TFBGA Tray
| Compliant | |
| 3A991b.1.a. | |
| Active | |
| 8542.32.00.51 | |
| Automotive | No |
| PPAP | No |
| NOR | |
| 512M | |
| Sectored | |
| Yes | |
| Symmetrical | |
| Bottom|Top | |
| 32 | |
| 4Kbyte x 16384 | |
| 256byte | |
| 8 | |
| 64M | |
| Yes | |
| Synchronous | |
| 7 | |
| 400/Chip | |
| 3/Page | |
| Serial (SPI, Dual SPI, Quad SPI) | |
| 2.7 | |
| 104 | |
| 3|3.3 | |
| 3.6 | |
| 2.7 to 3.6 | |
| 30 | |
| 25 | |
| -40 | |
| 85 | |
| Industrial | |
| Yes | |
| No | |
| No | |
| 100000 | |
| Tray | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.85(Max) |
| Verpackungsbreite | 6 |
| Verpackungslänge | 8 |
| Leiterplatte geändert | 24 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | TFBGA |
| 24 | |
| Leitungsform | Ball |
| EDA / CAD Models |
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