Winbond ElectronicsW25N01GVSFITFlash
SLC NAND Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 1G-bit 128M x 8 7ns 16-Pin SOIC W Tray
| Compliant | |
| 3A991b.1.a. | |
| Active | |
| 8542.32.00.51 | |
| Automotive | No |
| PPAP | No |
| SLC NAND | |
| 1G | |
| Sectored | |
| No | |
| Symmetrical | |
| 32 | |
| 128Kbyte x 1024 | |
| 2Kbyte | |
| 8 | |
| 128M | |
| Yes | |
| Synchronous | |
| 7 | |
| 0.01/Block | |
| 0.7/Page | |
| Serial (SPI, Dual SPI, Quad SPI) | |
| 104 | |
| 2.7 | |
| 3|3.3 | |
| 3.6 | |
| 2.7 to 3.6 | |
| 35 | |
| 35 | |
| -40 | |
| 85 | |
| Industrial | |
| Yes | |
| Yes | |
| Yes | |
| 100000 | |
| Tray | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 2.31 mm |
| Verpackungsbreite | 7.49 mm |
| Verpackungslänge | 10.31 mm |
| Leiterplatte geändert | 16 |
| Standard-Verpackungsname | SO |
| Lieferantenverpackung | SOIC W |
| 16 |
| EDA / CAD Models |
KI-Systeme in der Medizin
Design-Tipps, empfohlene Komponenten und KI-Insights für bessere Diagnose- und Therapiegeräte – im aktuellen Whitepaper.