Meist Gekauft
Winbond ElectronicsW25N01GVZEIGFlash
SLC NAND Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 1G-bit 128M x 8 7ns 8-Pin WSON EP Tray
| Compliant | |
| 3A991b.1.a. | |
| Active | |
| 8542.32.00.71 | |
| SVHC | Yes |
| Automotive | No |
| PPAP | No |
| SLC NAND | |
| 1G | |
| Sectored | |
| No | |
| Symmetrical | |
| 32 | |
| 128Kbyte x 1024 | |
| 2Kbyte | |
| 8 | |
| 128M | |
| Yes | |
| Synchronous | |
| 7 | |
| 0.01/Block | |
| 0.7/Page | |
| Serial (SPI, Dual SPI, Quad SPI) | |
| 104 | |
| 2.7 | |
| 3.3|3 | |
| 3.6 | |
| 2.7 to 3.6 | |
| 35 | |
| 35 | |
| -40 | |
| 85 | |
| Industrial | |
| Yes | |
| Yes | |
| Yes | |
| 100000 | |
| Tray | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.73 |
| Verpackungsbreite | 8 |
| Verpackungslänge | 6 |
| Leiterplatte geändert | 8 |
| Standard-Verpackungsname | SON |
| Lieferantenverpackung | WSON EP |
| 8 | |
| Leitungsform | No Lead |
| EDA / CAD Models |
Playbook: Smarte Drohnen-Systeme
Downloaden Sie das Playbook für praxisnahe Tools und Strategien zur Entwicklung agiler, effizienter und modularer Drohnensysteme.