Winbond ElectronicsW25N01GWTBIGFlash
NAND Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 1G-bit 128M x 8 8ns 24-Pin TFBGA Tray
| Compliant | |
| 3A991b.1.a. | |
| Active | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| NAND | |
| 1G | |
| Sectored | |
| No | |
| Symmetrical | |
| 32 | |
| 128Kbyte x 1024 | |
| 2Kbyte | |
| 8 | |
| 128M | |
| Yes | |
| Synchronous | |
| 8 | |
| 0.01/Block | |
| 0.7/Page | |
| Serial (SPI, Dual SPI, Quad SPI) | |
| 1.7 | |
| 1.8 | |
| 1.95 | |
| 1.7 to 1.95 | |
| 35 | |
| 35 | |
| -40 | |
| 85 | |
| Industrial | |
| Yes | |
| Yes | |
| No | |
| 100000 | |
| Tray | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.85 mm |
| Verpackungsbreite | 6 mm |
| Verpackungslänge | 8 mm |
| Leiterplatte geändert | 24 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | TFBGA |
| 24 | |
| Leitungsform | Ball |
| EDA / CAD Models |
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