Winbond ElectronicsW25N01JWTBIGFlash
SLC NAND Flash Serial (SPI, Dual SPI, Quad SPI) 1.8V 1G-bit 128M x 8 6ns 24-Pin TFBGA
The new W25N / W72N is a single-level cell (SLC) QspiNAND Flash IC built using Winbond’s proprietary 46nm fabrication process. SLC NAND has higher reliability than the higher-density multi-level cell (MLC) and triple-level cell (TLC).
Winbond new High Performance QspiNAND enables a data transfer rate four times faster than Parallel NAND and other QspiNAND currently on the market. Transferring data at 83MB/s, which far exceeds competing NAND flash on the market, Winbond's new solution accelerates instrument cluster boot-up time.
It also supports dual-quad I/O interface to accommodate higher storage density or data transfer rate up to 166 MB/s. The selection allowing for single, dual and quad I/O means customers can enjoy more flexibility compared to what competitors can offer. Furthermore, Winbond this new High Performance QspiNAND supports hardware reset pin which is more convenient for hardware / software design for automotive applications.
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| Compliant | |
| 3A991.b.1.a | |
| Active | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| SLC NAND | |
| 1G | |
| No | |
| 32 | |
| 2Kbyte | |
| 8 | |
| 128M | |
| Yes | |
| Synchronous | |
| 6 | |
| 0.01/Block | |
| 0.7 | |
| Serial (SPI, Dual SPI, Quad SPI) | |
| 1.7 | |
| 1.8 | |
| 1.95 | |
| 1.7 to 1.95 | |
| 35 | |
| 35 | |
| -40 | |
| 85 | |
| Industrial | |
| Yes | |
| Yes | |
| No | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.85 |
| Verpackungsbreite | 6 |
| Verpackungslänge | 8 |
| Leiterplatte geändert | 24 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | TFBGA |
| 24 |
| EDA / CAD Models |
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