Winbond ElectronicsW25N02KVTBIRFlash
SLC NAND Flash Serial (SPI, Dual SPI, Quad SPI) 3V/3.3V 2G-bit 256M x 8 7ns 24-Pin TFBGA
| Compliant | |
| Active | |
| EA | |
| Automotive | No |
| PPAP | No |
| SLC NAND | |
| 2G | |
| Sectored | |
| No | |
| Symmetrical | |
| 32 | |
| 128Kbyte x 2048 | |
| 2Kbyte | |
| 8 | |
| 256M | |
| Yes | |
| Synchronous | |
| 7 | |
| 0.01/Block | |
| 0.7/Page | |
| Serial (SPI, Dual SPI, Quad SPI) | |
| 2.7 | |
| 104 | |
| 3|3.3 | |
| 3.6 | |
| 2.7 to 3.6 | |
| 35 | |
| 35 | |
| -40 | |
| 85 | |
| Industrial | |
| Yes | |
| Yes | |
| Yes | |
| 60000 | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.85 |
| Verpackungsbreite | 6 |
| Verpackungslänge | 8 |
| Leiterplatte geändert | 24 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | TFBGA |
| 24 |
| EDA / CAD Models |
Playbook: Smarte Drohnen-Systeme
Downloaden Sie das Playbook für praxisnahe Tools und Strategien zur Entwicklung agiler, effizienter und modularer Drohnensysteme.