Winbond ElectronicsW25N512GVFIGFlash
SLC NAND Flash Serial (SPI, Dual SPI, Quad SPI) 3.3V 512M-bit 16-Pin SOIC W Tray
| Compliant | |
| 3A991.b.1.a | |
| Active | |
| 8542.32.00.71 | |
| Automotive | No |
| PPAP | No |
| SLC NAND | |
| 512M | |
| Sectored | |
| No | |
| 15 | |
| Yes | |
| Synchronous | |
| 0.01/Block | |
| 0.7 | |
| Serial (SPI, Dual SPI, Quad SPI) | |
| 2.7 | |
| 3.3 | |
| 3.6 | |
| 2.7 to 3.6 | |
| 35 | |
| -40 | |
| 85 | |
| Industrial | |
| Yes | |
| Yes | |
| No | |
| Tray | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 2.31 |
| Verpackungsbreite | 7.49 |
| Verpackungslänge | 10.31 |
| Leiterplatte geändert | 16 |
| Standard-Verpackungsname | SO |
| Lieferantenverpackung | SOIC W |
| 16 |
| EDA / CAD Models |
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