Winbond ElectronicsW29N02GVBIAAFlash
SLC NAND Flash Parallel 3V/3.3V 2G-bit 256M x 8 25ns 63-Pin VFBGA Automotive AEC-Q100
| Compliant | |
| 3A991b.1.a. | |
| Active | |
| 8542.32.00.71 | |
| Automotive | Yes |
| PPAP | Unknown |
| SLC NAND | |
| 2G | |
| Sectored | |
| No | |
| Symmetrical | |
| 29 | |
| 128Kbyte x 2048 | |
| 2Kbyte | |
| 8 | |
| 256M | |
| Yes | |
| Asynchronous | |
| 25 | |
| 0.01/Block | |
| 0.7/Page | |
| Parallel | |
| 2.7 | |
| 3|3.3 | |
| 3.6 | |
| 2.7 to 3.6 | |
| 35 | |
| 35 | |
| -40 | |
| 85 | |
| Industrial | |
| No | |
| Yes | |
| Yes | |
| 100000 | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.6(Max) |
| Verpackungsbreite | 9 |
| Verpackungslänge | 11 |
| Leiterplatte geändert | 63 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | VFBGA |
| 63 | |
| Leitungsform | Ball |
| EDA / CAD Models |
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