Winbond ElectronicsW97BH6KBVX2I TRDRAM-Chip
DRAM Chip Mobile LPDDR2 SDRAM 2Gbit 128Mx16 1.8V/1.2V 134-Pin VFBGA T/R
| Compliant | |
| EAR99 | |
| Active | |
| 8542.32.00.36 | |
| Automotive | No |
| PPAP | No |
| Mobile LPDDR2 SDRAM | |
| 2G | |
| 128Mx16 | |
| 8 | |
| 16M | |
| 16 | |
| 16 | |
| 400 | |
| 5.5 | |
| 17 | |
| HSUL_12 | |
| 1.7|1.14 | |
| 1.95|1.3 | |
| 150 | |
| -40 | |
| 85 | |
| 16 | |
| Tape and Reel | |
| Befestigung | Surface Mount |
| Verpackungshöhe | 0.58 mm |
| Verpackungsbreite | 10 mm |
| Verpackungslänge | 11.5 mm |
| Leiterplatte geändert | 134 |
| Standard-Verpackungsname | BGA |
| Lieferantenverpackung | VFBGA |
| 134 | |
| Leitungsform | Ball |
| EDA / CAD Models |
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