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Silicon LabsXG27-PK6018ARF/Drahtlos-Entwicklungsplatinen und Kits

EFR32BG27C320F768GJ39 Bluetooth Development Kit

EFR32xG27 Pro Kit

The EFR32xG27 +4 dBm Pro Kit (xG27-PK6018A) is designed to support the development of wireless IoT devices based on the EFR32xG27 in the CSP package and support the development of 2.4 GHz wireless protocols including BLE, and Bluetooth mesh.



Key Features and Benefits


  • Kit Contents
  • •  1 x WSTK main board
  • •  1 x BRD4110B 2.4 GHz +4 dBm Radio Board
  • •  Mini-simplicity cable
  • •  AA battery holder

  • Kit Features
  • •  Advanced Energy Monitor
  • •  Packet Trace Interface
  • •  Virtual COM port
  • •  SEGGER J-Link on-board debugger
  • •  External device debugging
  • •  Ethernet and USB connectivity
  • •  Ultra-low power 128 x 128 pixel LCDTFT
  • •  User LEDs / pushbuttons
  • •  20-pin 2.54 mm EXP header
  • •  Breakout pads for Wireless SoC I/O
  • •  CR2032 coin cell battery support


Applications


  • •  Portable Medical Devices
  • •  Smart Hospitals
  • •  Smart Wearable Devices


Related Products

EFR32BG27C230F768IM32-B
EFR32BG27C320F768GJ39-B

Import TariffMay apply to this part

10 Stück: morgen versandbereit

    Total73,25 €Price for 1

    • morgen versandbereit

      Ships from:
      Vereinigte Staaten von Amerika
      Date Code:
      2328+
      Manufacturer Lead Time:
      9 Wochen
      Country Of origin:
      Norwegen
      • In Stock: 10 Stück
      • Price: 73,254 €

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