Samsung Electro-Mechanics Capacitor Ceramic Multilayer
| Teile-Nr. | Preis | Bestand | Hersteller | Kategorie | Capacitance Value | Tolerance | Voltage | Dielectric | Technology | Special Features | Construction | Termination Style | Terminal Pitch - (mm) | Case Style | Package/Case | Size - (mm) | Packaging | Maximum Dissipation Factor - (%) | Equivalent Series Resistance Type | Rad Hard | CECC Qualified | ESD Protection | Military | AEC Qualified | AEC Qualified Number | Auto motive | P PAP | ECCN Code | SVHC | SVHC Exceeds Threshold |
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CL21C221GB61PNC
Cap Ceramic 220pF 50V C0G 2% Pad SMD 0805 125°C Automotive AEC-Q200
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0,0358 €
pro Stück
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 220pF | 2% | 50VDC | C0G | Standard | Flat | Pad | Ceramic Chip | 0805 | 2 X 1.25 X 0.6 | No | Yes | AEC-Q200 | Yes | Unknown | EAR99 | No | No | |||||||||
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CL21A226MRCLRNC
Cap Ceramic 22uF 4V X5R 20% Pad SMD 0805 85°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 22uF | 20% | 4VDC | X5R | Standard | Flat | Pad | Ceramic Chip | 0805 | 2 X 1.25 X 0.85 | Tape and Reel | No | No | No | No | No | EAR99 | No | No | ||||||||
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CL21C270JBANNND
Cap Ceramic 27pF 50V C0G 5% Pad SMD 0805 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 27pF | 5% | 50VDC | C0G | Standard | Flat | Pad | Ceramic Chip | 0805 | 2 X 1.25 X 0.65 | Tape and Reel | No | No | No | No | No | EAR99 | No | No | ||||||||
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CL05A224MQLHECE
Cap Ceramic 0.22uF 6.3V X5R 20% Pad SMD 0402 85°C T/R
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0,0681 €
pro Stück
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 0.22uF | 20% | 6.3VDC | X5R | Standard | Flat | Pad | Ceramic Chip | 0402 | 1 X 0.5 X 0.0975 | Tape and Reel | 10 | No | No | No | No | EAR99 | No | No | ||||||||
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CL10A226MR8NQNE
Cap Ceramic 22uF 4V X5R 20% Pad SMD 0603 85°C T/R
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Von 0,042 € bis 0,0458 €
pro Stück
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 22uF | 20% | 4VDC | X5R | Standard | Flat | Pad | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | 10 | No | Yes | No | No | No | No | EAR99 | No | No | ||||||
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CL10B472KB8SFNC
Cap Ceramic 0.0047uF 50V X7R 10% Pad SMD 0603 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 0.0047uF | 10% | 50VDC | X7R | Standard | Flat | Pad | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | 2.5 | No | No | No | No | No | EAR99 | No | No | |||||||
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CL10C1R8BB8NNND
Cap Ceramic 1.8pF 50V C0G 0.1pF Pad SMD 0603 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 1.8pF | 0.1pF | 50VDC | C0G | Standard | Flat | Pad | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | No | No | No | No | No | EAR99 | No | No | ||||||||
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CL31B471KGFNFNE
Cap Ceramic 470pF 500V X7R 10% Pad SMD 1206 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 470pF | 10% | 500VDC | X7R | Standard | Flat | Pad | Ceramic Chip | 1206 | 3.2 X 1.6 X 1.25 | Tape and Reel | 2.5 | No | Unknown | No | No | No | No | EAR99 | No | No | ||||||
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CL21C821JBCNNNL
Cap Ceramic 820pF 50V C0G 5% Pad SMD 0805 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 820pF | 5% | 50VDC | C0G | Standard | Flat | Pad | Ceramic Chip | 0805 | 2 X 1.25 X 0.85 | Tape and Reel | No | No | No | No | No | EAR99 | No | No | ||||||||
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CL10C470JB8NCNC
Cap Ceramic 47pF 50V C0G 5% Pad SMD 0603 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 47pF | 5% | 50VDC | C0G | Standard | Flat | Pad | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | No | No | No | No | No | EAR99 | No | No | ||||||||
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CL03C130GA3GNNC
Cap Ceramic 13pF 25V C0G 2% Pad SMD 0201 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 13pF | 2% | 25VDC | C0G | Standard | Flat | Pad | Ceramic Chip | 0201 | 0.6 X 0.3 X 0.3 | Tape and Reel | No | No | No | No | No | EAR99 | No | No | ||||||||
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CL10C182JB8NNND
Cap Ceramic 0.0018uF 50V C0G 5% Pad SMD 0603 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 0.0018uF | 5% | 50VDC | C0G | Standard | Flat | Pad | Ceramic Chip | 0603 | 1.6 X 0.8 X 0.8 | Tape and Reel | No | No | No | No | No | EAR99 | No | No | ||||||||
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CL21C561JBANNND
Cap Ceramic 560pF 50V C0G 5% Pad SMD 0805 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 560pF | 5% | 50VDC | C0G | Standard | Flat | Pad | Ceramic Chip | 0805 | 2 X 1.25 X 0.65 | Tape and Reel | No | No | No | No | No | EAR99 | No | No | ||||||||
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CL05C3R5CB5NNNC
Cap Ceramic 3.5pF 50V C0G 0.25pF Pad SMD 0402 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 3.5pF | 0.25pF | 50VDC | C0G | Standard | Flat | Pad | Ceramic Chip | 0402 | 1 X 0.5 X 0.5 | Tape and Reel | No | No | No | No | No | EAR99 | No | No | ||||||||
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CL05A225KQ5NFNC
Cap Ceramic 2.2uF 6.3V X5R 10% Pad SMD 0402 85°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 2.2uF | 10% | 6.3VDC | X5R | Standard | Flat | Pad | Ceramic Chip | 0402 | 1 X 0.5 X 0.5 | Tape and Reel | No | No | No | No | No | EAR99 | No | No | ||||||||
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CL03C270JA3ANNC
Cap Ceramic 27pF 25V C0G 5% Pad SMD 0201 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 27pF | 5% | 25VDC | C0G | Standard | Flat | Pad | Ceramic Chip | 0201 | 0.6 X 0.3 X 0.3 | Tape and Reel | No | No | No | No | No | EAR99 | No | No | ||||||||
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CL03C100GA3GNNC
Cap Ceramic 10pF 25V C0G 2% Pad SMD 0201 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 10pF | 2% | 25VDC | C0G | Standard | Flat | Pad | Ceramic Chip | 0201 | 0.6 X 0.3 X 0.3 | Tape and Reel | No | No | No | No | No | EAR99 | No | No | ||||||||
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CL03C100GA3GNNH
Cap Ceramic 10pF 25V C0G 2% Pad SMD 0201 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 10pF | 2% | 25VDC | C0G | Standard | Flat | Pad | Ceramic Chip | 0201 | 0.6 X 0.3 X 0.3 | Tape and Reel | No | No | No | No | No | EAR99 | No | No | ||||||||
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CL02C150JO2ANNC
Cap Ceramic 15pF 16V C0G 5% Pad SMD 01005 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 15pF | 5% | 16VDC | C0G | Standard | Flat | Pad | Ceramic Chip | 01005 | 0.4 X 0.2 X 0.2 | Tape and Reel | No | No | No | No | No | EAR99 | No | No | ||||||||
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CL03C150JA3ANNC
Cap Ceramic 15pF 25V C0G 5% Pad SMD 0201 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 15pF | 5% | 25VDC | C0G | Standard | Flat | Pad | Ceramic Chip | 0201 | 0.6 X 0.3 X 0.3 | Tape and Reel | No | No | No | No | No | EAR99 | No | No | ||||||||
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CL05B391KB5NCNC
Cap Ceramic 390pF 50V X7R 10% Pad SMD 0402 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 390pF | 10% | 50VDC | X7R | Standard | Flat | Pad | Ceramic Chip | 0402 | 1 X 0.5 X 0.5 | Tape and Reel | 2.5 | No | No | No | No | No | EAR99 | No | No | |||||||
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CL21B104KBANNNC
Cap Ceramic 0.1uF 50V X7R 10% Pad SMD 0805 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 0.1uF | 10% | 50VDC | X7R | Standard | Flat | Pad | Ceramic Chip | 0805 | 2 X 1.25 X 0.65 | Tape and Reel | No | Unknown | No | No | No | No | EAR99 | No | No | |||||||
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CL21A106KQQN3NE
Cap Ceramic 10uF 6.3V X5R 10% Pad SMD 0805 85°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 10uF | 10% | 6.3VDC | X5R | Standard | Flat | Pad | Ceramic Chip | 0805 | 2 X 1.25 X 1.25 | Tape and Reel | 10 | No | No | No | No | No | EAR99 | No | No | |||||||
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CL21A106KPFNFNE
Cap Ceramic 10uF 10V X5R 10% Pad SMD 0805 85°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 10uF | 10% | 10VDC | X5R | Standard | Flat | Pad | Ceramic Chip | 0805 | 2 X 1.25 X 1.25 | Tape and Reel | 10 | No | No | No | No | No | EAR99 | No | No | |||||||
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CL21C151JDCNCNC
Cap Ceramic 150pF 200V C0G 5% Pad SMD 0805 125°C T/R
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Samsung Electro-Mechanics | Kondensator, keramisch, mehrschichtig | 150pF | 5% | 200VDC | C0G | Standard | Flat | Pad | Ceramic Chip | 0805 | 2 X 1.25 X 0.85 | Tape and Reel | No | No | No | No | No | EAR99 | No | No |