NXP AI Thermal Sensing
AI Thermal Imaging System
This solution is an advanced thermal imaging solution that combines Melexis MLX90640 32x24 far-infrared thermal sensor array with the NXP MCX-N9 series high-performance deep learning MCU. This powerful integration enables precise measurement of human or object surface temperatures with exceptional accuracy.
NXP MCX-N9. This advanced series debuts NXP's proprietary Neural Processing Unit (NPU). The integrated NPU provides up to 30x the machine learning (ML) throughput compared to a CPU, with a high level of integration and accurate simulation capabilities.
NXP AI Object Recognition
(1) NXP i.MX93 Reference Development Platform: EIC-i.MX93-210
The solution uses einfochips EIC-i.mx93-210 and onsemi AR0234 CMOS sensor. AI model can be accelerated by NPU.With using different AI model, can show AI object recognition and AI people counting function.
The EIC- i.MX93-210 is an RDP based on the i.MX93 application processors. The processor features a scalable Arm Ethos™-U65 microNPU Core for efficient machine learning acceleration, as well as advanced security with an integrated EdgeLock secure enclave to support edge computing. The RDP enables developers to begin creating high-performance, cost-effective, and energy-efficient machine-learning applications. Wi-Fi, Bluetooth, Gigabit Ethernet, CAN, and 3G/4G/LTE connectivity via a Mezzanine Card are all available. The kit includes pre-integrated Linux, making it an excellent choice for applications such as industrial automation, smart home & intelligent appliances, smart buildings, and automotive.
CLICK HERE TO DOWNLOAD “AI OBJECT RECOGNITION SOLUTION
CLICK HERE TO LEARN MORE ABOUT NXP i.MX93 REFERENCE DEVELOPMENT PLATFORM: EIC-i.MX93-210
(2) AI/ML Demo based on i.MX 93 Applications Processor
i.MX 93 applications processors feature an innovative energy-flex architecture that empowers industrial, IoT and automotive applications. This video demonstrate AI/ML deployments with the i.MX 93 applications processor and its integrated NPU. These demos leverage NXP's i.MX 93 evaluation kit (EVK) and a USB camera connected to the EVK for image collection.
Six different machine learning examples are demonstrated including Driver monitoring system, facial recognition, gesture and pose detection, depth detection, object detection and segmentation. The inference time for each demo are also included.The demo runs on i.MX 93 Evaluation Kit and leverages NXP's eIQ toolkit, providing a reference for AI/ML application development utilizing the Arm Ethos-U65 neural processing unit.
onsemi Camera Module
(1) Image Sensors - AR0234CS
The AR0234CS is a 1/2.6−inch 2Mp CMOS digital image sensor with an active−pixel array of 1920 (H) x 1200 (V). It incorporates a new innovative global shutter pixel design optimized for accurate and fast capture of moving scenes at 120 frame per second, full resolution.The sensor produces clear, low noise images in both low−light and bright scenes. It includes sophisticated camera functions such as auto exposure control, windowing, row skip mode, column−skip mode, pixel−binning, and both video and single frame modes. It is programmable through a simple two−wire serial interface. The AR0234CS produces extraordinarily clear, sharp digital pictures with an industry leading Global Shutter Efficiency, and its ability to capture both continuous video and single frames makes it the perfect choice for a wide range of applications, including scanning, autonomous mobility, surveillance and industrial quality control.
(2) onsemi image sensor AR0234CS in a Customer’s Camera module
See3CAM_24CUG
See3CAM_24CUG is a 2.3 MP global shutter color camera, UVC compliant, USB 3.2 Gen 1 SuperSpeed camera from e-con Systems, which has over two decades of experience in designing, developing, and manufacturing OEM cameras. It is the latest member of the See3CAM family of USB 3.2 Gen 1 SuperSpeed camera products.
See3CAM_24CUG is a 2.3 MP color camera with the S-mount (also known as M12 board lens) lens holder. The S-mount is one of the most commonly used small form factor lens mounts for board cameras. See3CAM_24CUG is a single-board solution containing the camera sensor module board with 1/2.6" AR0234CS CMOS digital image sensor, global shutter from ON Semiconductor® and the USB 3.2 Gen 1 interface board. It is also backward compatible with the USB 2.0 high speed interface, albeit at lower frame rates.
See3CAM_24CUG is a UVC compliant USB 3.2 Gen 1 SuperSpeed camera that is also backward compatible with USB 2.0 host ports and it does not require any special camera drivers to be installed on the PC. The native UVC drivers of Windows and Linux Operating Systems (OS) will be compatible with this camera. e-con Systems also provides the sample application that demonstrates some of the features of this camera.