Miniaturization for smart IoT devices
Gain insights into overcoming miniaturization challenges associated with antenna design and PCB connectors and components.
There are unique challenges with integrating multiple wireless technologies into smart IoT devices, including the need to be waterproof and withstand high temperatures, shock and vibration. Rugged and robust designs, miniaturization, long battery life and high performance are all critical factors that allow these devices to deliver reliable, seamless connectivity.
Discover TE’s design considerations for overcoming these challenges in this informative white paper and
on-demand webinar.
Zukünftige Events
Einladung zum Arrow MultiSolutions Day Frankfurt 2025
Diese besondere Veranstaltung wird von den Arrow Sales Büros Advantage, Automotive, Core Frankfurt und EMS ausgerichtet und ermöglicht Ihnen, in einer offenen Messeatmosphäre eine beeindruckende Vielfalt an Kunden, Dienstleistern und Lieferanten aus unterschiedlichen Branchen und Industriesegmenten kennenzulernen.
Invitation to the Arrow Multi Solutions Day UK 2026
This special event is hosted by the Arrow Sales Offices Advantage, Automotive, Core Frankfurt, and EMS, and gives you the opportunity to meet an impressive variety of customers, service providers, and suppliers from different industries and sectors in an open exhibition atmosphere.